# JCET to build automotive chip advanced packaging factory in Shanghai

JCET Group announced a capital increase of RMB 4.4 billion for its holding company JCET Automotive Electronics to accelerate construction of an advanced packaging facility for automotive chips in Lingang, Shanghai. The project started in August 2023 and is expected to be completed in 2025.

- Type: New facility
- Announced: 2023-11-01
- Where: Lingang, Shanghai, China, China
- Value: $602.0M (4.40B CNY)
- Starts operating: 2025
- Status: under construction
- Capacity: factory area of approximately 200,000 square meters
- Products: automotive chip advanced packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Automotive Components](https://endata.com/sectors/automotive-components.md)

## Companies

- [JCET](https://endata.com/companies/16865.md)

## Sources

- [jcetglobal.com](https://www.jcetglobal.com/en/site/news-detail?id=1936), 2023-11-01: "JCET is proud to announce that its holding company, JCET Automotive Electronics (Shanghai) Co., Ltd. is set to receive a capital increase of RMB 4.4 billion, resulting in a registered capital of RMB 4.8 billion."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.