# HKSTP and J2 Semiconductor sign MoU for SiC wafer fab in Hong Kong

Hong Kong Science and Technology Parks Corporation (HKSTP) and J2 Semiconductor (Shanghai) Co. Ltd. signed an MoU to establish Hong Kong's first Silicon Carbide (SiC) 8-inch advanced wafer fab and a global R&D centre. Total investment is estimated at HK$6.9 billion, with volume production planned in a couple of years and annual capacity projected at 240,000 wafers by 2028.

- Type: Partnership
- Announced: 2023-10-13
- Where: Hong Kong Science Park, Hong Kong SAR China
- Value: $880.0M (6.90B HKD)
- Jobs: 700
- Status: announced
- Capacity: 240,000 wafers per year
- Products: Silicon Carbide (SiC) 8-inch wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hong Kong Science & Technology Parks Corporation](https://endata.com/companies/42612.md) (partner)
- [J2 Semiconductor (Shanghai) Co. Ltd.](https://endata.com/companies/73411.md) (partner)

## Sources

- [hkstp.org](https://www.hkstp.org/en/park-life/news-and-events/news/hkstp-and-jsup2sup-semiconductor-sign-mou-to-promote-the-development-of-microelectronics-indust), 2023-10-13: "Total investment estimated to be HK$6.9 billion."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.