# Zhengqi Semiconductor to build power module plant in Hangzhou

Zhengqi Semiconductor's Hangzhou project will build a third-generation semiconductor module factory in Xiaoshan Economic and Technological Development Zone. Initial investment $30 million, total investment 1 billion yuan, with 10 intelligent module packaging production lines. Annual capacity of 60,000 high-end aerospace and automotive-grade IGBT and SiC chips/modules. Production expected to start mid-2024.

- Type: New facility
- Announced: 2023-10-24
- Where: Xiaoshan, Hangzhou, Zhejiang, China
- Value: $137.0M (1.00B CNY)
- Starts operating: Jun 2024
- Status: under construction
- Capacity: 60,000 units per year
- Products: IGBT modules, SiC modules, power modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Automotive Components](https://endata.com/sectors/automotive-components.md), [Aerospace Components](https://endata.com/sectors/aerospace-components.md)

## Companies

- [Zhengqi Semiconductor](https://endata.com/companies/73196.md)

## Sources

- [compoundsemiconductorchina.net](https://www.compoundsemiconductorchina.net/industry-news.asp?id=5424), 2023-10-24: "该项目已经开始装修设计阶段，预计于2024年中旬投产通线"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.