# Dexin Chip breaks ground on power device R&D and production base in Suzhou

Dexin Chip Technology Co., Ltd. held a groundbreaking ceremony for a high-power device wafer R&D and production base in Suzhou Industrial Park. The project has a total investment of 5 billion yuan, with phase I fixed investment of 1.4 billion yuan, planning a 6-inch production line with a capacity of 70,000 wafers per month.

- Type: New facility
- Announced: 2023-09-20
- Where: Suzhou Industrial Park, Suzhou, Jiangsu, China
- Status: under construction
- Capacity: 70,000 wafers per month
- Products: high-power FRD, MEMS, power semiconductor devices
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Dexin Chip Technology](https://endata.com/companies/72768.md)
- [Suzhou Good-Ark Electronics Co., Ltd.](https://endata.com/companies/42875.md) (investor)
- [Oriental Semiconductor](https://endata.com/companies/72769.md) (investor)

## Sources

- [zgjssw.gov.cn](https://www.zgjssw.gov.cn/shixianchuanzhen/suzhou/202309/t20230921_8093545.shtml), 2023-09-21: "德信芯片将在苏州工业园区建设高端功率器件晶圆研发生产基地，预计总投资50亿元，研发生产高端功率器件。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.