# CDIL Semiconductors to add new assembly lines, increasing capacity by 100 million units

CDIL Semiconductors will add new semiconductor packaging lines via the Indian government's SPECS scheme, aiming to increase annual capacity by 100 million units. The first phase, a surface mount packaging line of 50 million devices, will be inaugurated on September 28, 2023.

- Type: Expansion
- Announced: 2023-09-21
- Where: India, India
- Starts operating: 28 Sep 2023
- Status: under construction
- Capacity: 100 million units per year
- Products: semiconductor chips, semiconductor components, discrete semiconductor devices
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [CDIL Semiconductors](https://endata.com/companies/72763.md)

## Sources

- [cdil.com](https://www.cdil.com/news/2023/9/29/cdil-semiconductors-to-add-new-assembly-lines-to-increase-its-capacity-by-100-million-units), 2023-09-21: "CDIL Semiconductors will be adding new semiconductor packaging lines via the Government of India and MeitY’s SPECS scheme."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.