# Hanmi Semiconductor wins $31.4 million order from SK Hynix for HBM bonder

Hanmi Semiconductor secured a 41.5 billion won ($31.4 million) deal with SK Hynix for the second-generation DUAL TC BONDER 1.0 Dragon, used in high-bandwidth memory (HBM) process for AI semiconductors.

- Type: Contract
- Announced: 2023-09-01
- Where: South Korea
- Value: $31.4M
- Status: announced
- Products: DUAL TC BONDER 1.0 Dragon, high-bandwidth memory (HBM) equipment
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [SK Hynix](https://endata.com/companies/2769.md) (customer)
- [Hanmi Semiconductor](https://endata.com/companies/22183.md) (supplier)

## Sources

- [kedglobal.com](https://www.kedglobal.com/us/korean-chipmakers/newsView/ked202309010003), 2023-09-01: "South Korean chip equipment company Hanmi Semiconductor Co. said on Friday that it has secured a 41.5 billion won ($31.4 million) deal with SK Hynix Inc."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.