# Sivers Semiconductors and PseudolithIC awarded DARPA contract for 3D microelectronics

Sivers Semiconductors AB's US subsidiary and PseudolithIC Inc received a $375,000 award under the DARPA Next-Generation Microelectronics Manufacturing program to develop 3D heterogeneously integrated technologies for millimeter-wave applications in 5G, SATCOM, and defense.

- Type: Contract
- Announced: 2023-08-11
- Where: United States
- Value: $375K
- Status: completed
- Products: 3D heterogeneously integrated technologies, millimeter-wave systems
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Sivers Semiconductors](https://endata.com/companies/21027.md) (supplier)
- [DARPA](https://endata.com/companies/34950.md) (customer)
- [PseudolithIC Inc.](https://endata.com/companies/71985.md) (supplier)

## Sources

- [pseudolithic.com](https://www.pseudolithic.com/news/sivers-and-pseudolithic-secure-darpa-contract-for-advancing-3d-microelectronics-in-5g-and-defense), 2023-08-11: "The program aims to develop three-dimensional heterogeneously integrated (3DHI) technologies."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.