# TSMC, Bosch, Infineon, NXP form joint venture ESMC for Dresden fab

TSMC, Bosch, Infineon, and NXP plan to jointly invest over €10 billion in European Semiconductor Manufacturing Company (ESMC) GmbH to build a 300mm fab in Dresden, Germany, with production targeted by end of 2027.

- Type: Acquisition
- Announced: 2023-08-08
- Where: Dresden, Germany
- Value: $10.9B (10.0B EUR)
- Jobs: 2,000
- Status: announced
- Capacity: 40,000 300mm wafers per month
- Products: 300mm wafers on 28/22nm and 16/12nm process technologies
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Robert Bosch](https://endata.com/companies/3006.md) (investor)
- [Infineon Technologies AG](https://endata.com/companies/15717.md) (investor)
- [TSMC](https://endata.com/companies/15886.md) (investor)
- [NXP Semiconductors](https://endata.com/companies/19521.md) (investor)
- [European Semiconductor Manufacturing Company (ESMC) GmbH](https://endata.com/companies/71893.md) (target)

## Sources

- [infineon.com](https://www.infineon.com/press-release/2023/infxxx202308-144), 2023-08-08: "TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.