# Infineon and Semikron Danfoss sign multi-year supply agreement for electromobility chips

Infineon Technologies and Semikron Danfoss signed a multi-year volume agreement for the supply of silicon-based IGBTs and diodes for electromobility. The chips will be manufactured at Infineon's sites in Dresden, Germany, and Kulim, Malaysia.

- Type: Contract
- Announced: 2023-07-12
- Status: completed
- Products: IGBTs, diodes, power modules for inverters
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Automotive Components](https://endata.com/sectors/automotive-components.md)

## Companies

- [Infineon Technologies AG](https://endata.com/companies/15717.md) (supplier)
- [Semikron Danfoss](https://endata.com/companies/64842.md) (customer)

## Sources

- [infineon.com](https://www.infineon.com/technology-news/2023/infatv202307-128), 2023-07-12: "Infineon Technologies AG and Semikron Danfoss have signed a multi-year volume agreement for the supply of silicon-based electromobility chips."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.