# Dongni Electronics signs silicon carbide substrate supply contract

Dongni Electronics' subsidiary Dongni Semiconductor signed a contract with customer T to deliver 135,000 6-inch silicon carbide substrates in 2023 for a total of RMB 675 million, with further deliveries planned for 2024 and 2025.

- Type: Contract
- Announced: 2023-01-09
- Where: China
- Value: $97.5M (675.0M CNY)
- Status: announced
- Products: 6-inch silicon carbide substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Dongni Electronics](https://endata.com/companies/70266.md)
- [Dongni Semiconductor](https://endata.com/companies/70267.md)
- [Customer T](https://endata.com/companies/70268.md) (customer)

## Sources

- [spec.icspec.com](https://spec.icspec.com/blog/14278), 2023-05-14: "东尼电子发布公告称，公司子公司东尼半导体与下游客户T签订《采购合同》，约定东尼半导体2023年向该客户交付6英寸碳化硅衬底13.50万片，含税销售金额合计人民币6.75亿元"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.