# Fraunhofer IIS/EAS and Achronix partner to build heterogeneous chiplet demonstrator

Fraunhofer IIS/EAS and Achronix Semiconductor entered a partnership to build a heterogeneous chiplet solution using Achronix eFPGA IP, aimed at validating chip-to-chip interconnect technology.

- Type: Partnership
- Announced: 2023-04-25
- Where: Dresden, Germany
- Status: announced
- Products: eFPGA IP, chiplet solution
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Achronix Semiconductor](https://endata.com/companies/46153.md) (partner)
- [Fraunhofer IIS/EAS](https://endata.com/companies/69936.md) (partner)

## Sources

- [prnewswire.com](https://www.prnewswire.com/news-releases/fraunhofer-iiseas-selects-achronix-embedded-fpgas-efpgas-to-build-heterogeneous-chiplet-demonstrator-301806013.html), 2023-04-25: "Fraunhofer IIS/EAS and Achronix Semiconductor Corporation are entering today in a partnership to build a heterogeneous chiplet solution."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.