# BAE Systems receives multichip prototypes from Intel and Qorvo under SHIP program

BAE Systems accepted the first multichip prototypes from Intel and Qorvo under the Department of Defense's SHIP program. Intel delivered a digital multichip package and Qorvo delivered a radio frequency module, to be transitioned into electronic warfare systems.

- Type: Contract
- Announced: 2023-04-10
- Where: Falls Church, Virginia, United States
- Status: completed
- Products: multichip prototypes, digital multichip package, radio frequency module
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [BAE Systems](https://endata.com/companies/4538.md) (customer)
- [Qorvo](https://endata.com/companies/20471.md) (supplier)
- [Intel](https://endata.com/companies/21062.md) (supplier)

## Sources

- [govconwire.com](https://www.govconwire.com/articles/bae-receives-multichip-prototypes-from-intel-qorvo-under-dods-ship-program), 2023-04-10: "BAE Systems has accepted from Intel and Qorvo the first set of multichip prototypes developed under the Department of Defense's State-of-the-art Heterogeneous Integrated Packaging program."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.