# Resonac to invest ¥5.2B to boost semiconductor adhesive film capacity by 1.6x

Resonac will invest 5.2 billion yen to expand production capacity of dicing-die bonding integrated film for semiconductor packaging at its Goi plant in Kamisu, Japan, by about 1.6 times. Operations are scheduled to start in 2026.

- Type: Expansion
- Announced: 2023-04-04
- Where: Kamisu, Ibaraki Prefecture, Japan
- Value: $39.0M (5.20B JPY)
- Starts operating: 2026
- Status: announced
- Capacity: 1.6 times current capacity
- Products: dicing-die bonding integrated film, adhesive film for semiconductor packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Resonac](https://endata.com/companies/12729.md)

## Sources

- [resonac.com](https://www.resonac.com/jp/news/2023/04/04/2441.html), 2023-04-04: "中長期的な需要拡大に対応すべく設備投資を実施"
- [ap.resonac.com](https://ap.resonac.com/resonac-increases-production-capacity-adhesive-film-semiconductor-packaging/), 2023-04-04: "Resonac will start to operate expanded production facilities in 2026."
- [prtimes.jp](https://prtimes.jp/main/html/rd/p/000000045.000102176.html), 2023-04-04: "52億円を投じてグループ全体の生産能力を従来の約1.6倍に増やします。稼働開始は2026年の予定です。"
- [aei.dempa.net](https://aei.dempa.net/archives/14956), 2023-04-05: "Resonac decides to ramp up the production capacity of Dicing Die Bonding Film by 60% from the present level."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.