# Tianshu Huatian to build $415M chip packaging plant in Nanjing

Tianshu Huatian Technology plans to build a CNY 2.9 billion (USD 415.4 million) advanced semiconductor packaging and testing factory in Nanjing, China, with annual capacity of 480,000 pieces of Wafer-level Chip Scale Packaging. Construction is expected to start in June 2023 and finish by June 2028.

- Type: New facility
- Announced: 2023-03-28
- Where: Nanjing, Jiangsu, China
- Value: $415.4M (2.90B CNY)
- Starts operating: Jun 2028
- Status: announced
- Capacity: 480,000 pieces of Wafer-level Chip Scale Packaging per year
- Products: advanced chip packaging, Wafer-level Chip Scale Packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tianshu Huatian Technology](https://endata.com/companies/69371.md)

## Sources

- [yicaiglobal.com](https://www.yicaiglobal.com/news/china-huatian-to-spend-usd4154-million-on-new-cutting-edge-chip-packaging-plant), 2023-03-28: "The new plant is expected to generate CNY266 million (USD38.6 million) in net profit a year and revenue of CNY1.3 billion (USD183.1 million) once it is up and running."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.