# Silan Microelectronics plans 6.5 billion yuan investment in chip and SiC projects

Silan Microelectronics (士兰微) announced a non-public share issuance plan to raise up to 6.5 billion yuan for three projects: a 12-inch wafer production line (360,000 wafers/year), a SiC power device production line (144,000 wafers/year), and an automotive semiconductor packaging project (7.2 million modules/year). The application was accepted by the Shanghai Stock Exchange on March 1, 2023.

- Type: Investment
- Announced: 2023-03-09
- Where: China
- Value: $940.0M (6.50B CNY)
- Status: announced
- Capacity: 360,000 12-inch wafers/year; 144,000 SiC wafers/year; 7.2 million automotive power modules/year
- Products: 12-inch power chips, SiC power devices, automotive power modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Silan Microelectronics](https://endata.com/companies/28894.md)

## Sources

- [seccw.com](https://www.seccw.com/document/detail/id/18877.html), 2023-03-09: "The project's implementation will help improve the company's supply guarantee capability and customer supply chain security."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.