# Tongfu Microelectronics mass-produces Chiplet chips for AMD

Tongfu Microelectronics announced it has mass-produced chiplet products for AMD using advanced packaging technologies. The company is AMD's largest packaging and testing supplier, accounting for over 80% of its orders.

- Type: Product launch
- Announced: 2023-02-17
- Where: China
- Status: completed
- Products: chiplet chips, advanced packaging services
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tongfu Microelectronics Co., Ltd.](https://endata.com/companies/22832.md)
- [AMD](https://endata.com/companies/15370.md) (customer)

## Sources

- [sensor360.org](https://www.sensor360.org/news/detail/162595), 2023-02-17: "The company has adopted multi-chip components and integrated fan-out packaging, 2.5D/3D and other advanced packaging technologies, it can provide customers with diversified chiplet packaging solutions, and has mass-produced chiplet products for AMD."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.