# Adeia licenses hybrid bonding technology to Qorvo

Adeia Inc. announced that Qorvo has licensed Adeia's hybrid bonding technology for semiconductor applications.

- Type: Contract
- Announced: 2023-02-15
- Status: announced
- Products: hybrid bonding technology
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Adeia](https://endata.com/companies/68582.md)
- [Qorvo](https://endata.com/companies/20471.md) (customer)

## Sources

- [globenewswire.com](https://www.globenewswire.com/news-release/2023/02/15/2608708/0/en/adeia-and-qorvo-enter-into-hybrid-bonding-license-agreement.html), 2023-02-15: "Semiconductor industry leaders are looking to 3D structures, packages and interconnect innovations to elevate performance and expand functionality on miniaturized footprints."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.