# Tongfu Microelectronics holds topping-out ceremony for Phase III project in Suzhou

Nantong Tongfu Microelectronics Co., Ltd. held the topping-out ceremony for its third-phase project at the Su-Xi-Tong Industrial Park on November 30, 2022. The project spans over 100,000 square meters. The announcement was made on December 2, 2022.

- Type: Expansion
- Announced: 2022-12-02
- Where: Su-Xi-Tong Industrial Park, Suzhou, China
- Status: under construction
- Products: semiconductor packaging, microelectronics
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Nantong Tongfu Microelectronics Co., Ltd.](https://endata.com/companies/67049.md)

## Sources

- [en.tfme.com](https://en.tfme.com/news/1063.html), 2022-12-02: "The simultaneous commencement of construction on the third-phase project—spanning over 100,000 square meters—is a rare milestone in the development history of Tongfu Microelectronics Group."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.