# Lam Research acquires SEMSYSCO to advance chip packaging

Lam Research Corp. completed the acquisition of SEMSYSCO GmbH, a provider of wet processing semiconductor equipment, from Gruenwald Equity and other investors. Financial terms were not disclosed. The acquisition adds capabilities in advanced packaging for chiplet-based solutions.

- Type: Acquisition
- Announced: 2022-11-15
- Where: Fremont, California, United States
- Status: completed
- Products: wet processing semiconductor equipment, advanced packaging solutions
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Lam Research](https://endata.com/companies/26776.md) (acquirer)
- [SEMSYSCO GmbH](https://endata.com/companies/66652.md) (target)
- [Gruenwald Equity](https://endata.com/companies/66845.md) (partner)

## Sources

- [newsroom.lamresearch.com](https://newsroom.lamresearch.com/2022-11-15-Lam-Research-Acquires-SEMSYSCO-to-Advance-Chip-Packaging), 2022-11-15: "Lam Research Corp. today announced that it has completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment from Gruenwald Equity and other investors."
- [yna.co.kr](https://www.yna.co.kr/view/RPR20221124003200353), 2022-11-24: "The strategic acquisition of SEMSYSCO furthers our commitment to help chipmakers address their emerging technology challenges, adding deep capabilities in advanced substrates and packaging processes."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.