# Wingtech to invest CNY 3B expanding Nexperia chip packaging plant in Dongguan

Wingtech Technology announced plans to invest CNY 3 billion (USD 411 million) to expand capacity at the semiconductor packaging and testing plant of Nexperia Semiconductors China in Dongguan, Guangdong. Construction will begin within 12 months and be completed in 1.5 years.

- Type: Expansion
- Announced: 2022-10-24
- Where: Dongguan, Guangdong province, China
- Value: $411.0M (3.00B CNY)
- Status: announced
- Products: semiconductor devices, analog integrated circuits, logic ICs, MOSFETs
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Wingtech Technology](https://endata.com/companies/35119.md)
- [Nexperia Semiconductors China](https://endata.com/companies/66075.md) (partner)

## Sources

- [yicaiglobal.com](https://www.yicaiglobal.com/news/china-wingtech-to-spend-usd411-million-to-expand-nexperia-semiconductor-packaging-testing-plant), 2022-10-25: "Wingtech Technology has announced plans to invest CNY3 billion (USD411 million) expanding capacity at the semiconductor packaging and testing plant of Nexperia Semiconductors China."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.