# Silan Micro plans to raise CNY6.5B for auto chip expansion

Silan Microelectronics aims to raise CNY6.5 billion (USD903 million) in a private placement to fund three projects: a new 12-inch power chip plant in Hangzhou (CNY3 billion), expansion of SiC chip capacity in Xiamen (CNY750 million), and a semiconductor packaging plant in Chengdu (CNY1.1 billion). Each project is expected to take three years.

- Type: Investment
- Announced: 2022-10-17
- Where: Hangzhou, Xiamen, Chengdu, China
- Value: $903.0M (6.50B CNY)
- Starts operating: 2025
- Status: announced
- Capacity: 360,000 units of 12-inch power chips per year; 144,000 SiC chips per year; 7.2 million automotive power modules per year
- Products: power semiconductors, silicon carbide chips, automotive power modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Automotive Components](https://endata.com/sectors/automotive-components.md)

## Companies

- [Silan Microelectronics](https://endata.com/companies/28894.md)

## Sources

- [yicaiglobal.com](https://www.yicaiglobal.com/news/china-silan-taps-into-local-auto-chip-demand-via-usd903-million-expansion), 2022-10-17: "This is one of the company’s core strategic plans in the field of high-end power semiconductors."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.