# CanSemi starts third-phase expansion at 12-inch fab in Guangzhou

CanSemi Technology has kicked off its third-phase expansion at its 12-inch wafer fab in Guangzhou, China, with total investment of CNY 16.25 billion (US$2.355 billion). The expansion will add 40,000 wafers per month capacity, reaching 120,000 by 2025, with processes advancing to 55-40nm and 22nm.

- Type: Expansion
- Announced: 2022-09-01
- Where: Guangzhou, southern China, China
- Value: $2.35B (16.3B CNY)
- Starts operating: 2024
- Status: under construction
- Capacity: 40,000 wafers per month additional; total 120,000 wafers per month by 2025
- Products: analog chips, power electronics, server chips, power devices, signal chain ICs, MCUs, PMICs, image sensor chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [CanSemi Technology](https://endata.com/companies/33661.md)

## Sources

- [digitimes.com](https://www.digitimes.com/newsshow/article.asp?datePublish=2022%2F09%2F01&pages=pd&seq=205), 2022-09-01: "CanSemi's third-phase capacity will be mainly for producing power electronics, server chips, power devices for 5G infrastructure and automotive applications."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.