# Suzhou Keyang Semiconductor plans $59M CIS chip packaging project

Suzhou Keyang Semiconductor Co., Ltd., a controlled subsidiary of Dagang Co., plans to invest approximately CNY 424 million (approx. USD 59 million) to build a 12-inch CIS chip TSV wafer-level packaging project with a capacity of 6,000 wafers per month. The project will be implemented in two phases.

- Type: Investment
- Announced: 2022-08-23
- Where: China
- Value: $59.0M (424.0M CNY)
- Status: announced
- Capacity: 6000 wafers per month
- Products: CIS chip TSV wafer-level packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Suzhou Keyang Semiconductor Co., Ltd.](https://endata.com/companies/64864.md)
- [Dagang Co.](https://endata.com/companies/43861.md) (investor)

## Sources

- [zhitongcaijing.com](https://www.zhitongcaijing.com/content/detail/776697.html), 2022-08-23: "公司控股孙公司苏州科阳半导体有限公司拟使用自筹资金投资建设12吋CIS芯片TSV晶圆级封装项目，产能6000片/月，预计总投资约4.24亿元。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.