# Chengdu Gaotou Xinwei starts construction of $148M power semiconductor plant

Chengdu Gaotou Xinwei Semiconductor Co. started construction of a 1 billion yuan ($148 million) high-end power semiconductor device and module R&D and production project in Chengdu High-tech West Zone. The first phase will build an 8-inch ultra-thin IGBT backside wafer line and a power semiconductor packaging line, with production expected to begin in Q4 2023.

- Type: New facility
- Announced: 2022-08-09
- Where: Chengdu High-tech West Zone, Sichuan, China
- Value: $148.0M
- Starts operating: Q4 2023
- Status: under construction
- Capacity: 120,000 power semiconductor modules per year; 100,000 integrated assemblies per year (Phase 1)
- Products: IGBT chips, power semiconductor modules, integrated assemblies
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Chengdu Gaotou Xinwei Semiconductor](https://endata.com/companies/64641.md)

## Sources

- [sc.people.com.cn](http://sc.people.com.cn/n2/2022/0809/c379471-40072300.html), 2022-08-09: "一期将建设一条8英寸超薄IGBT特色背面晶圆线，一条高端功率半导体集成封装生产线，计划今年年底完成厂房封顶。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.