# NXP Semiconductors partners with Foxconn on smart connected vehicles

NXP Semiconductors has signed a memorandum of understanding with Hon Hai Technology Group (Foxconn) to jointly develop platforms for a new generation of smart connected vehicles, starting with a digital cockpit partnership based on NXP i.MX processors and Software Defined Radio platform.

- Type: Partnership
- Announced: 2022-07-20
- Status: announced
- Products: automotive chips, digital cockpit platforms, S32 processors, radar systems, UWB and BLE secure car access
- Sectors: [Automotive Components](https://endata.com/sectors/automotive-components.md), [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [NXP Semiconductors](https://endata.com/companies/19521.md) (partner)
- [Hon Hai Technology Group](https://endata.com/companies/50180.md) (partner)

## Sources

- [eenewseurope.com](https://www.eenewseurope.com/en/nxp-teams-with-foxconn-on-next-generation-vehicle-designs/), 2022-07-20: "Foxconn sees the disruptive challenges and the potential for innovation in today’s automotive industry."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.