# SK hynix to build $3.9B advanced packaging facility in West Lafayette, Indiana

SK hynix announced plans to invest almost $3.9 billion to build an advanced packaging facility for AI products and an R&D facility at Purdue University in West Lafayette, Indiana. Production is expected to begin in late 2028.

- Type: New facility
- Announced: 2022-07-17
- Where: West Lafayette, Indiana, United States
- Value: $3.90B
- Starts operating: Q4 2028
- Status: announced
- Products: advanced chip packaging for AI
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [SK Hynix](https://endata.com/companies/2769.md)

## Sources

- [uspublicworks.com](https://uspublicworks.com/billion-dollar-projects/), 2022-07-17: "SK hynix (SK) (www.skhynix.com), a South Korean manufacturer of High Bandwidth Memory (HBM) chips announced they were investing almost $3.9 billion to build an advanced packaging facility for AI (Artificial Intelligence) products and an R&D facility at Purdue University, West Lafayette Indiana."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.