# Semikron qualifies Rohm's fourth-gen SiC power chips for eMPack modules

Semikron qualified Rohm Semiconductor's fourth-generation silicon carbide power chips for its automotive eMPack modules. Semikron has a billion-euro contract to supply these modules to a major German carmaker starting in 2025.

- Type: Partnership
- Announced: 2022-07-14
- Where: Germany
- Status: announced
- Products: fourth-generation SiC power chips, eMPack power modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Automotive Components](https://endata.com/sectors/automotive-components.md)

## Companies

- [SEMIKRON](https://endata.com/companies/9059.md)
- [SEMIKRON](https://endata.com/companies/9059.md) (customer)
- [RÖHM Group](https://endata.com/companies/18449.md) (supplier)
- [ROHM Semiconductor](https://endata.com/companies/61439.md) (partner)

## Sources

- [eenewseurope.com](https://www.eenewseurope.com/en/389729/), 2022-07-14: "Semikron in Germany has qualified the fourth generation silicon carbide (SiC) technology from Rohm Semiconductor for its automotive eMPack modules."
- [eefocus.com](https://www.eefocus.com/article/522112.html), 2022-07-17: "罗姆第四代SiC MOSFET器件已在赛米控的车用eMPack®功率模块上验证合格。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.