# Silan Micro subsidiary to build automotive power module packaging plant in Chengdu

Silan Micro's holding subsidiary Chengdu Silan Semiconductor Manufacturing Co., Ltd. plans to invest 3 billion yuan to build an automotive-grade power module packaging project with an annual capacity of 720,000 pieces. The construction period is 3 years.

- Type: New facility
- Announced: 2022-06-13
- Where: Chengdu, China
- Value: $447.0M (3.00B CNY)
- Status: announced
- Capacity: 720,000 pieces per year
- Products: automotive-grade power modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Automotive Components](https://endata.com/sectors/automotive-components.md)

## Companies

- [Silan Micro](https://endata.com/companies/63468.md)
- [Chengdu Silan Semiconductor Manufacturing Co., Ltd.](https://endata.com/companies/63469.md)

## Sources

- [ictransistors.com](https://www.ictransistors.com/news/silan-micro-the-subsidiary-invested-3-billion-58140117.html), 2022-06-14: "Silan Micro plans to invest in the construction of 'annual production capacity of 720,000 pieces of automotive-grade power module packaging project'."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.