# Ibiden to build IC package substrate plant in Ogaki, Japan

Ibiden held a groundbreaking ceremony for a new building at its Kawama site in Ogaki, Gifu Prefecture, to produce high-performance IC package substrates. Total investment is 180 billion yen, with completion scheduled for the second half of fiscal 2023.

- Type: New facility
- Announced: 2022-06-03
- Where: Ogaki, Gifu Prefecture, Japan
- Value: $1.38B (180.0B JPY)
- Starts operating: Q4 2023
- Status: under construction
- Products: high-performance IC package substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [IBIDEN Co., Ltd.](https://endata.com/companies/23859.md)

## Sources

- [automation-news.jp](https://www.automation-news.jp/2022/06/63126/), 2022-06-03: "総投資額は1800億円で、スマートファクトリーとして2023年度下期に竣工予定となっています。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.