# Baoding Qianxin plans 2.8B yuan 6-inch wafer fab in Hangzhou

Baoding Qianxin (Hangzhou) Integrated Circuit Co., Ltd. plans a 6-inch semiconductor integrated circuit manufacturing line in Hangzhou, with total investment of 2.8 billion yuan. The project will have combined annual capacity of 1.72 million 6-inch and 8-inch wafers.

- Type: New facility
- Announced: 2022-04-26
- Where: Hangzhou, Zhejiang, China
- Value: $420.0M (2.80B CNY)
- Status: announced
- Capacity: 172万片每年 (1.72 million wafers per year combined 6-inch and 8-inch)
- Products: VDMOS, MEMS, IGBT power devices
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Baoding Qianxin (Hangzhou) Integrated Circuit Co., Ltd.](https://endata.com/companies/62505.md)

## Sources

- [eet-china.com](https://www.eet-china.com/mp/a127524.html), 2022-04-26: "项目规划二期建设，总投资在28亿元，一期与二期总设计产能在6英寸与8英寸合计172万片每年"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.