# Ibiden holds groundbreaking for new building at Kawama plant for IC package substrates

Ibiden Co., Ltd. held a groundbreaking ceremony on April 15, 2022, for a new building at its Kawama plant to increase production capacity for high-performance IC package substrates. The building is scheduled for completion in the second half of fiscal year 2023.

- Type: Expansion
- Announced: 2022-04-01
- Where: Kawama plant, Japan
- Starts operating: Q4 2023
- Status: under construction
- Products: high-performance IC package substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [IBIDEN Co., Ltd.](https://endata.com/companies/23859.md)

## Sources

- [ibiden.co.jp](https://www.ibiden.co.jp/company/2022/04/ic-1.html), 2022-04-01: "2022年4月15日に新棟建設の起工式を行いましたので、お知らせいたします。"

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.