# Samsung Electro-Mechanics invests 300 billion won in Busan substrate capacity

Samsung Electro-Mechanics invested 300 billion won ($247 million) to expand semiconductor package substrate capacity at its Busan plant, producing FCBGA packages for PCs and servers.

- Type: Investment
- Announced: 2022-03-21
- Where: Busan, South Korea
- Value: $247.0M (300.0B KRW)
- Status: announced
- Products: flip-chip ball grid array (FCBGA) packages
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electro-Mechanics](https://endata.com/companies/15109.md)

## Sources

- [koreajoongangdaily.com](https://www.koreajoongangdaily.com/business/samsung-electromechanics-invests-in-capacity-expansion/10030833), 2022-03-21: "The funding will be used to produce flip-chip ball grid array (FCBGA) packages, a sophisticated type of chip substrate designed to bind together high-performing processors and protect them from the surrounding environment."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.