# Fastprint Circuit Tech to build $949M chip packaging substrate plant in Guangzhou

Fastprint Circuit Tech will invest CNY6 billion (USD949 million) to build a plant in Guangzhou, China, to produce 20 million flip chip ball grid array substrates per month, with first phase operational by June 2025 and full capacity by December 2027.

- Type: New facility
- Announced: 2022-02-09
- Where: Guangzhou, China
- Value: $949.0M (6.00B CNY)
- Starts operating: Jun 2025
- Status: announced
- Capacity: 20 million FCBGA substrates per month
- Products: flip chip ball grid array substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Fastprint Circuit Tech](https://endata.com/companies/40313.md)

## Sources

- [yicaiglobal.com](https://www.yicaiglobal.com/news/fastprint-aims-to-meet-chinese-demand-for-chip-packaging-substrates-with-new-usd949-million-plant), 2022-02-09: "China's Fastprint Circuit Tech will invest CNY6 billion (USD949 million) to build a plant to satisfy mostly domestic clients' demand for semiconductor packaging solutions amid the global chip shortage."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.