# Fastprint Technology to invest CNY6 billion in FCBGA substrate plant in Guangzhou

Fastprint Technology (Shenzhen Fastprint Circuit Tech) plans to invest about CNY6 billion to build an FCBGA packaging substrate production and R&D base in Guangzhou, with a monthly capacity of 20 million units.

- Type: New facility
- Announced: 2022-02-08
- Where: Guangzhou, China, China
- Value: $945.0M (6.00B CNY)
- Status: announced
- Capacity: 20 million FCBGA packaging substrates per month
- Products: FCBGA packaging substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shenzhen Fastprint Circuit Tech](https://endata.com/companies/60898.md)

## Sources

- [beta.zhitongcaijing.com](http://beta.zhitongcaijing.com/content/detail/655025.html), 2022-02-08: "项目总投资额预计约人民币60亿元。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.