# Toshiba to build 300mm power chip plant in Ishikawa

Toshiba will build a new 300mm wafer fabrication plant for power semiconductors in Ishikawa Prefecture, Japan, investing about 100 billion yen ($870 million) to more than double production capacity by March 2025.

- Type: New facility
- Announced: 2022-02-04
- Where: Ishikawa Prefecture, Japan
- Value: $870.0M (100.0B JPY)
- Starts operating: Mar 2025
- Status: announced
- Capacity: 2.5 times fiscal 2021 capacity
- Products: power semiconductors
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Toshiba](https://endata.com/companies/8893.md)

## Sources

- [bloomberg.com](https://www.bloomberg.com/news/articles/2022-02-04/toshiba-to-more-than-double-power-chip-output-with-new-plant), 2022-02-04: "Toshiba Corp. will build a new 300-millimeter wafer fabrication plant for power semiconductors that will more than double its production capacity by March 2025, the company announced Friday."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.