# Tanaka Denshi Kogyo to build aluminum bonding wire plant in Hangzhou

TANAKA Denshi Kogyo will establish a new plant in Hangzhou, China, to produce aluminum bonding wires for power semiconductors. Operations are scheduled to begin in November 2022, as part of a plan to triple production capacity by 2025.

- Type: New facility
- Announced: 2022-01-12
- Where: Hangzhou City, China
- Starts operating: Nov 2022
- Status: announced
- Products: aluminum bonding wires for power semiconductors
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [TANAKA Denshi Kogyo K.K.](https://endata.com/companies/60290.md)
- [TANAKA Holdings Co., Ltd.](https://endata.com/companies/60291.md) (partner)

## Sources

- [jcnnewswire.com](https://www.jcnnewswire.com/english/pressrelease/72287/2/TANAKA-Denshi-Kogyo-to-Establish-New-Plant-in-Hangzhou,-China), 2022-01-12: "TANAKA Denshi Kogyo K.K. ... will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.