# Samsung Electro-Mechanics invests $850M in FC-BGA production in Vietnam

Samsung Electro-Mechanics announced an investment of $850 million (approximately KRW 1.1 trillion) in production facilities and infrastructure for Flip Chip-Ball Grid Array (FC-BGA) semiconductor substrates in Vietnam. The investment will be implemented consecutively until 2023.

- Type: Investment
- Announced: 2021-12-25
- Where: Vietnam, Vietnam
- Value: $850.0M
- Status: announced
- Products: FC-BGA semiconductor substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electro-Mechanics](https://endata.com/companies/15109.md)

## Sources

- [sammyfans.com](https://www.sammyfans.com/2021/12/25/samsung-electro-mechanics-confirms-investment-to-fc-bga-production/), 2021-12-25: "The company held a board meeting on the 23rd and announced that it would invest $850 million in production facilities and infrastructure for the production of the Flip Chip (FC)-Ball Grid Array (BGA) in Vietnam."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.