# Zhuhai Yuexin Semiconductor breaks ground on CNY 3.5B packaging substrate plant

Zhuhai Yuexin Semiconductor Co., Ltd., a subsidiary of Yueya Semiconductor, held a groundbreaking ceremony for a new CNY 3.5 billion high-end RF and FCBGA packaging substrate manufacturing project in Zhuhai's Fushan Industrial Park. The plant will produce Via Post, embedded, and FCBGA substrates.

- Type: New facility
- Announced: 2021-12-08
- Where: Zhuhai, Guangdong, China
- Value: $550.0M (3.50B CNY)
- Status: under construction
- Capacity: Via Post substrate 12,000+ panels/month, embedded substrate 2,000+ panels/month, FCBGA substrate 6,000+ panels/month
- Products: RF packaging substrates, FCBGA packaging substrates, embedded packaging substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Zhuhai Yuexin Semiconductor](https://endata.com/companies/59574.md)
- [Yueya Semiconductor](https://endata.com/companies/59575.md) (partner)

## Sources

- [eet-china.com](https://www.eet-china.com/mp/a96208.html), 2021-12-09: "2021年12月8日上午，广东省珠海市斗门区富山工业园富山三路南侧、涌南二路以东热闹非凡，彩旗招展，气球高悬，珠海越芯半导体有限公司的'高端射频及FCBGA封装载板生产制造项目奠基仪式'在此隆重举行。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.