# UMC and Chipbond establish strategic cooperation through share exchange

United Microelectronics Corporation (UMC) and Chipbond Technology Corporation have agreed to a share exchange to establish a long-term strategic partnership. Chipbond will issue new shares in exchange for UMC shares, with UMC and its subsidiary Fortune Venture Capital holding about 9.09% of Chipbond.

- Type: Partnership
- Announced: 2021-09-03
- Where: TWN
- Status: announced
- Products: wafer manufacturing services, IC packaging and testing, LCD driver IC, compound semiconductor Gallium Nitride (GaN) power components, radio frequency components
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [United Microelectronics Corporation](https://endata.com/companies/19674.md) (partner)
- [Chipbond Technology](https://endata.com/companies/50576.md) (partner)
- [Fortune Venture Capital](https://endata.com/companies/57509.md) (partner)

## Sources

- [chipbond.com.tw](https://www.chipbond.com.tw/en/news/information/content/20210903), 2021-09-03: "In order to further establish a long-term strategic partnership, the two Companies decide to acquire the other party’s common shares in the form of share exchange."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.