# Winbond to build $12B DRAM fab in Kaohsiung, Taiwan

Winbond Electronics Corp is building a new 12-inch DRAM fab in Kaohsiung, Taiwan, with a planned investment of NT$335 billion (US$12.08 billion) over 10 years. The fab is expected to begin small-volume production in July 2022 and regular production in October 2022, with a target capacity of 35,000 wafers per month.

- Type: New facility
- Announced: 2021-09-02
- Where: Kaohsiung, Taiwan, TWN
- Value: $12.1B (335.0B TWD)
- Jobs: 400
- Starts operating: Oct 2022
- Status: under construction
- Capacity: 35,000 wafers per month
- Products: DRAM chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Winbond Electronics](https://endata.com/companies/26748.md)

## Sources

- [taipeitimes.com](https://www.taipeitimes.com/News/biz/archives/2021/09/03/2003763688), 2021-09-02: "The Kaohsiung fab is set to produce a small volume of DRAM chips in July next year in preparation for regular production in October"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.