# Zhenming Semiconductor to invest 200 million yuan in IC packaging expansion

Zhenming Semiconductor's integrated circuit packaging R&D and industrialization expansion project in Weifang will invest 200 million yuan to achieve annual packaging capacity of 1.8 billion units, with completion expected by December 2021.

- Type: Expansion
- Announced: 2021-08-25
- Where: Weifang, Shandong, China
- Value: $31.0M (200.0M CNY)
- Starts operating: Dec 2021
- Status: announced
- Capacity: 1.8 billion units per year
- Products: integrated circuit packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Zhenming Semiconductor](https://endata.com/companies/57299.md)

## Sources

- [gxt.shandong.gov.cn](http://gxt.shandong.gov.cn/art/2021/8/25/art_15166_10293760.html), 2021-08-25: "贞明半导体集成电路封装研发及产业化扩产项目，预计2021年12月建成，项目总投资2亿元，形成年封装18亿颗的生产能力。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.