# NHanced Semiconductors expands North Carolina foundry with high-volume advanced packaging line

NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume advanced packaging line. The new line is expected to begin production in the second half of 2022, capable of producing up to 10,000 3DIC wafer stacks per month.

- Type: Expansion
- Announced: 2021-06-15
- Where: Morrisville, North Carolina, United States
- Starts operating: Q3 2022
- Status: announced
- Capacity: 10,000 3DIC wafer stacks per month
- Products: advanced packaging, 3DIC wafer stacks, 2.5D interposer fabrication, die-to-wafer assembly
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [NHanced Semiconductors](https://endata.com/companies/55821.md)

## Sources

- [businesswire.com](https://www.businesswire.com/news/home/20210614005832/en/Dedicated-HighVolume-Advanced-Packaging-Facility-First-in-US-Announced-by-NHanced-Semiconductors), 2021-06-15: "The new line is expected to begin production in the second half of 2022, capable of constructing up to 10,000 3DIC wafer stacks per month."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.