# Zing Semiconductor breaks ground on 300mm silicon wafer project in Shanghai

Shanghai Zing Semiconductor Co., Ltd. held a groundbreaking ceremony for a new project to add 300,000 pieces of 300mm high-end silicon wafers for integrated circuits, including a new No. 5 plant in Lingang New Area.

- Type: Expansion
- Announced: 2021-05-25
- Where: Lingang New Area, Shanghai, China
- Status: under construction
- Capacity: 300,000 pieces of 300mm silicon wafers per month
- Products: 300mm high-end silicon wafers for integrated circuits
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shanghai Zing Semiconductor](https://endata.com/companies/55375.md)

## Sources

- [zingsemi.com](https://www.zingsemi.com/news/%E6%96%B0%E5%A2%9E30%E4%B8%87%E7%89%87%E9%9B%86%E6%88%90%E7%94%B5%E8%B7%AF%E7%94%A8300mm%E9%AB%98%E7%AB%AF%E7%A1%85%E7%89%87%E7%A0%94%E5%8F%91%E4%B8%8E%E5%85%88%E8%BF%9B%E5%88%B6%E9%80%A0%E9%A1%B9/), 2021-05-25: "2021年5月25日，上海新昇半导体科技有限公司“新增30万片集成电路用300mm高端硅片研发与制造项目暨五号厂房”开工仪式在临港新片区云水路1000号厂区内举行。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.