# Foxconn and Yageo form semiconductor joint venture XSemi

Foxconn and Yageo formed a joint venture called XSemi, headquartered in Hsinchu, Taiwan, to develop semiconductor chips for electric vehicles, robotics and health electronics.

- Type: Partnership
- Announced: 2021-05-05
- Where: Hsinchu, TWN
- Status: announced
- Products: semiconductor chips, analog chips, mixed-signal chips, power chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [XSemi Corporation](https://endata.com/companies/54916.md)
- [Foxconn](https://endata.com/companies/15170.md) (partner)
- [Yageo Corporation](https://endata.com/companies/21631.md) (partner)
- [XSemi Corporation](https://endata.com/companies/54916.md) (partner)

## Sources

- [eenewseurope.com](https://www.eenewseurope.com/en/foxconn-yageo-form-semiconductor-joint-venture-xsemi/), 2021-05-11: "Foxconn, the world’s leading assembler of electronic equipment and Yageo... said they want to extend their businesses into the semiconductor industry."
- [zhschip.com](https://www.zhschip.com/blog/details/foxconn-and-yageo-to-establish-small-ic-semiconductor-company.html), 2021-10-08: "At a May 5 press conference, Foxconn and Yageo Corp. announced plans to establish a semiconductor company called XSemi Corporation that will focus on 'small IC' development and sales."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.