# Intel to invest $3.5 billion in New Mexico semiconductor packaging facility

Intel announced a $3.5 billion investment to equip its Rio Rancho, New Mexico operations for advanced semiconductor packaging technologies, including Foveros 3D packaging. The project is expected to create 700 high-tech jobs and 1,000 construction jobs.

- Type: Expansion
- Announced: 2021-05-03
- Where: Rio Rancho, New Mexico, United States
- Value: $3.50B
- Jobs: 700
- Status: announced
- Products: advanced semiconductor packaging (Foveros 3D packaging)
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Intel](https://endata.com/companies/21062.md)

## Sources

- [intc.com](https://www.intc.com/news-events/press-releases/detail/1464/intel-to-invest-3-5-billion-to-expand-new-mexico), 2021-05-03: "A key differentiator for our IDM 2.0 strategy is our unquestioned leadership in advanced packaging, which allows us to mix and match compute tiles to deliver the best products."
- [governor.state.nm.us](https://www.governor.state.nm.us/2021/05/03/new-mexico-applauds-intels-3-5-billion-expansion-in-rio-rancho/), 2021-05-03: "Intel's $3.5 billion investment in New Mexico will create 700 new jobs in the next three years and establish the Rio Rancho campus as the company's domestic hub for advanced semiconductor manufacturing."
- [krqe.com](https://www.krqe.com/news/business/intel-expected-to-announce-3-5b-expansion-to-rio-rancho-facility/), 2021-05-03: "We're having a $3.5 billion modernization of that factory there."
- [silicon.co.uk](https://www.silicon.co.uk/workspace/components/intel-to-invest-3-5bn-to-expand-new-mexico-factory-395809), 2021-05-04: "A key differentiator for our IDM 2.0 strategy is our unquestioned leadership in advanced packaging, which allows us to mix and match compute tiles to deliver the best products."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.