# Draper awarded $14M DoD contracts for advanced packaging expansion

Draper received two U.S. Department of Defense contracts totaling $14 million to expand domestic production capabilities for 3D ultra-high-density microelectronics modules, with i3 Microsystems as major subcontractor.

- Type: Contract
- Announced: 2021-03-30
- Where: Cambridge, Massachusetts, United States
- Value: $14.0M
- Status: announced
- Products: 3D ultra-high-density microelectronics modules, fan-out wafer level packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Draper](https://endata.com/companies/54105.md)
- [U.S. Department of Defense](https://endata.com/companies/4836.md) (customer)
- [i3 Microsystems](https://endata.com/companies/33678.md) (partner)

## Sources

- [draper.com](https://www.draper.com/media-center/news-releases/detail/23188/draper-awarded-14m-by-dod-for-trusted-advanced-packaging-capability-expansion-with-i3-microsystems-as-major-subcontractor), 2021-03-30: "Draper announced today it has been selected for two U.S. Department of Defense (DoD) contracts, totaling $14 million, to enhance the U.S.’s ability for volume production of advanced packaging solutions for computer chips embedded within defense systems."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.