# Power Semiconductor breaks ground on 12-inch wafer fab in Tongluo, Taiwan

Power Semiconductor Manufacturing Co., Ltd. held a groundbreaking ceremony for its 12-inch wafer fab in Tongluo, Taiwan. The total investment is 63.6 billion yuan, with production expected to start in phases in 2023 and a monthly capacity of 100,000 wafers.

- Type: New facility
- Announced: 2021-03-25
- Where: Tongluo, Taiwan, TWN
- Value: $9.80B (63.6B CNY)
- Starts operating: 2023
- Status: under construction
- Capacity: 100,000 wafers per month
- Products: 12-inch wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Power Semiconductor Manufacturing Co., Ltd.](https://endata.com/companies/54051.md)

## Sources

- [power-ic.cn](http://power-ic.cn/English/ShowNews/98), 2021-03-26: "On March 25th, chip foundry company Power Semiconductor Manufacturing Co., Ltd. held a groundbreaking ceremony for its 12-inch fab in Tongluo, Taiwan, China."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.