# Samsung enters equipment installation phase for phase-2 NAND flash plant in Xi'an

Samsung China Semiconductor's 12-inch NAND flash memory chip phase II project in Xi'an, China, entered equipment installation phase on March 11, 2021. Completion and operation are expected by mid-2021, with output reaching 130,000 wafers per month.

- Type: Expansion
- Announced: 2021-03-11
- Where: Xi'an, Shaanxi Province, China
- Starts operating: Q3 2021
- Status: under construction
- Capacity: 130,000 wafers per month
- Products: NAND flash memory chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)

## Sources

- [globaltimes.cn](https://www.globaltimes.cn/page/202103/1218073.shtml), 2021-03-11: "The 12-inch NAND flash memory chip phase II project of Samsung China Semiconductor Co in Xi'an, Northwest China's Shaanxi Province, entered equipment installation phase on Thursday."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.