# Toshiba to build 300mm wafer fab for power devices in Nomi, Japan

Toshiba Electronic Devices & Storage Corporation will construct a 300-millimeter wafer fabrication facility at Kaga Toshiba Electronics Corporation in Nomi, Ishikawa Prefecture, Japan, to expand production capacity for power devices. Mass production is expected to start in the first half of fiscal year 2023.

- Type: Expansion
- Announced: 2021-03-01
- Where: Nomi, Ishikawa Prefecture, Japan, Japan
- Starts operating: Q2 2023
- Status: announced
- Capacity: 300-millimeter wafer fabrication facility
- Products: low-voltage MOSFETs, IGBTs, power devices
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Toshiba Electronic Devices & Storage Corporation](https://endata.com/companies/32335.md)
- [Kaga Toshiba Electronics Corporation](https://endata.com/companies/53533.md)

## Sources

- [toshiba.semicon-storage.com](https://toshiba.semicon-storage.com/ap-en/company/news/news-topics/2021/03/corporate-20210310-1.html), 2021-03-01: "Toshiba will expand production capacity for power devices with the construction of a 300-millimeter wafer fabrication facility at Kaga Toshiba Electronics Corporation in Japan."
- [toshiba.semicon-storage.com](https://toshiba.semicon-storage.com/us/company/news/2021/03/corporate-20210310-1.html), 2021-03-10: "Toshiba will expand production capacity for power devices with the construction of a 300-millimeter wafer fabrication facility at Kaga Toshiba Electronics Corporation in Japan."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.