# Keyang Semiconductor completes 8-inch CIS chip wafer-level packaging expansion

Keyang Semiconductor, a subsidiary of *ST Dagang, has completed the first phase expansion of its 8-inch CIS chip wafer-level packaging line, adding 3,000 wafers per month of capacity, which has reached full production.

- Type: Expansion
- Announced: 2021-02-19
- Where: China
- Starts operating: 19 Feb 2021
- Status: completed
- Capacity: 3,000 wafers per month
- Products: CIS chip wafer-level packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Keyang Semiconductor](https://endata.com/companies/53348.md)
- [*ST Dagang](https://endata.com/companies/53349.md)

## Sources

- [m.cls.cn](https://m.cls.cn/detail/687851), 2021-02-19: "科阳半导体8 吋CIS芯片晶圆级封装一期扩产3000片/月已达产"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.